Embedded Computing Market

The global Embedded Computing market in the report includes the Merchant Embedded Computing (MEC) market, the Commercial-Off-the-Shelf (COTS) market and the embedded motherboards market.  While the MEC and COTS markets cater to the low volume embedded systems market, the motherboards market caters to the high volume PC market segment.

An embedded system is a computer system designed for specific control functions within a larger system, often with real-time computing constraints. It is embedded as part of a complete device often including hardware and mechanical parts. By contrast, a general-purpose computer, such as a personal computer (PC), is designed to be flexible and to meet a wide range of end-user needs.

A COTS product is one that is used “as-is.” COTS products are designed to be easily installed and to interoperate with existing system components. Normally the term COTS is used with regard to Military requirements or military contracts to indicate that military specifications are not required or not to be followed [to save cost]. However components may still be required to operate under military temperature ranges, which would have to be tested for compliance.

The MEC industry targets five specific application markets: Communications, Industrial, Medical, Military/aerospace and an “others” category that includes transportation, security, surveillance, point of-sale/kiosk applications, etc. However out of the mentioned application markets, currently the embedded computing market has its majority market share coming from the wired and wireless communications segment The MEC industry can also be separated based on architectures and form factors. The different bus architectures and form factors are summed in the table below.

Bus Architectures and Form Factors of Embedded Computing Market 

Bus Architectures Form Factors
VMEbus (PMC, 2eSST, PCI-X, etc.) Single Board Computer
PCI, Compact PCI Digital Signal Processor Boards
Advanced TCA, Compact TCA, MicroTCA I/O Boards
Advanced MC, PC/104 Motherboards
Intel and VIA Motherboards  
ATX, MicroATX, FlexATX, BTX, Mini-ITX,Nano-ITX, Pico-ITX  
COM (ETX, COM Express, XTX, Rugged COM, Qseven, Other COM)  

For more information, see:

http://www.mindcommerce.com/Publications/NextGenWirelessDevices.php

About Mind Commerce

Analysis of telecom and ICT infrastructure, technologies, and applications.
This entry was posted in Augmented Reality, Computing, Devices, M2M. Bookmark the permalink.

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